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DFN/QFN series

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  Production Overview

        TFME offers various FCCSP and FCLGA package based on customer different requirement.



Features
- SiP (FC + SMT + Wire bond) available.
- CUF, MUF available.
- 7N/12N/14N/16N wafer node mass production
- Various substrate technology qualified including SAP, MSAP, ETS, MIS and SLP.
- Fully Turnkey for wafer bumping, probing, assembly, FT available.


Process Capability & Design Rule


Reliability Test Standards

Shipment Packing



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