DFN/QFN series

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  Production Overview

        TFME offers various FCCSP and FCLGA package based on customer different requirement.

- SiP (FC + SMT + Wire bond) available.
- CUF, MUF available.
- 7N/12N/14N/16N wafer node mass production
- Various substrate technology qualified including SAP, MSAP, ETS, MIS and SLP.
- Fully Turnkey for wafer bumping, probing, assembly, FT available.

Process Capability & Design Rule

Reliability Test Standards

Shipment Packing


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地址:江苏省澳门市崇川路288号 电 话:0513-85058888 传 真:0513-85058868

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